“Performance” Oryon: Qualcomm’s Little Core
Qualcomm’s Snapdragon X2 Elite uses a hybrid core setup, breaking away from the all-big-core strategy that the company previously used with in-house core designs.
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RSSNvidia Vera’s System Architecture: Pushing Bandwidth
Nvidia’s Vera server chip aims for high per-core performance.
NVIDIA’s Olympus Core: Pushing Server Single Threaded Performance Boundaries
Server chips traditionally offered less single threaded performance than contemporary client parts.
Qualcomm’s System Level Architecture in the Snapdragon X2 Elite
Laptop chips have gotten very powerful in recent years, with increasing CPU core counts, more powerful iGPUs, and higher DRAM bandwidth to feed that compute.
Qualcomm’s Adreno X2 GPU
Integrated GPUs have become a crucial component in recent laptop chips, thanks to a push for better graphics performance in ultraportable devices.
On Binary Translation and its Consequences
The PC market is one of the toughest areas for a CPU designer to compete in.
Arm’s C2-Ultra, G2-Ultra NX, and CSS N4 IP
Editor’s Note (9/8/2026): Arm has reached out to clarify that the maximum IPC increase of the C2-Ultra core over the C1-Ultra core using the parameters shown in the endnotes is 7% along with the memory bandwidth improvement not factoring into the IPC improvement.
Hot Chips 2026: Interviewing IBM's Christian Zoellin & Christian Jacobi
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Hot Chips 2026: XCENA and Samsung’s Near-Memory Compute CXL Device
CXL memory expansion, with a side of compute
Hot Chips 2026: Samsung’s Processing-in-Memory (PIM)
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Hot Chips 2026: Intel’s Crescent Island
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Hot Chips 2026: Fujitsu’s Monaka CPU
Building on a long history of HPC-focused cores, and looking beyond HPC
Hot Chips 2026: Intel’s Diamond Rapids
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SiFive’s First Server Platform
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Hot Chips 2026: Intel’s Wildcat Lake
All about making things affordable
Hot Chips 2026: CUDA Targets RISC-V
CUDA is the most important software framework in the GPU compute world, and Nvidia is looking at supporting CUDA on RISC-V. Terms and conditions may apply.
Hot Chips 2026: Applying High Bandwidth Flash (HBF)
Machine learning workloads have an insatiable appetite for DRAM capacity. Flash memory is cheaper per gigabyte of capacity than DRAM. Could it offer a way out?
Hot Chips 2026: Samsung and HBM Base Die Opportunities
Machine learning applications demand ever more memory capacity and bandwidth. Samsung responded by fabricating their HBM base dies on a logic node, which opens up more opportunities
Talking with Synopsys about the Physics of Chip Design at DAC 2026
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NVIDIA’s Vera Whitepaper Has a Thread Loose
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