SiliconFeeds

Hardware & semiconductor news

RSS
Electronics Weekly David Manners

Exploiting Piezoelectricity

A PROPERTY of many semiconductors which so far has not been exploited is that of piezoelectricity. So, 65 years ago, started a story in the ‘Tomorrow’s Thinking’ column of […] The post Exploiting Piezoelectricity appeared first on Electronics Weekly.

Asianometry Asianometry

How Intel Discovered Linux — and the Ketchup Business Model

Links: - Patreon (Support the channel directly!): https://www.patreon.com/Asianometry - X: https://twitter.com/asianometry - Newsletter & Podcast (available through Stratechery Plus): https://asianometry.passport.online/ - LinkedIn (feel free to connect): www.linkedin.com/in/jon-y-asianometry

TechPowerUp DrUsmanSaleem

Surface Laptop Ultra Gets Its First Firmware Fix for Flickering and Slow Reboots

Microsoft has rolled out the first firmware update for its RTX Spark-powered Surface Laptop Ultra, less than a week after the laptop started shipping on October 16. Listed in Windows Update as "System Hardware Update 200.0.7.0," the October 22 release fixes three problems spelled out in Microsoft's update history:…

TechPowerUp Cpt.Jank

NVIDIA Allegedly Stops Accepting RTX 5090 Orders

Although NVIDIA has officially denied the discontinuation of the GeForce RTX 5090, more rumors are emerging that substantiate claims about the flagship gaming GPU being discontinued. This time, NVIDIA board partners are reporting that NVIDIA has officially stopped accepting orders for the 5090, according to a recent…

TechPowerUp AleksandarK

Intel "Raptor Lake Next" 16-Core and 20-Core CPUs Surface

Intel is actively planning the "Raptor Lake Next" chips as an update to its Socket LGA-1700 desktop processors. These chips are essential for PC buyers who are limited to the decade-old DDR4 memory standard due to the high prices of DDR5 memory, especially since the current Core Ultra "Arrow Lake" processors do not…

Gamers Nexus Gamers Nexus

Your Router Spies On You. It's Time to Build Your Own | DIY Router Guide

SPONSOR: Contribute to FULU Foundation's Consumer Rights Wiki https://geni.us/lAWAZ or join their Zulip server to take action! https://geni.us/jeEBB Find their bounties here: https://geni.us/Iyzy2n It's time to apply all the DIY PC spirit and desire for knowledge toward device ownership, decentralizing, and taking…

Electronics Weekly Alun Williams

Tearing down the Apple iPhone Duo

Apple will take 25% of the Foldable Smartphone market in 2026, according to Counterpoint Research. But how repairable will the iPhone Duo prove to be? The post Tearing down the Apple iPhone Duo appeared first on Electronics Weekly.

TechPowerUp AleksandarK

TSMC A14 Node to Break Eight Years of SRAM Scaling Stagnation

TSMC, the world's largest and most advanced semiconductor manufacturer, has been grappling with stagnant progress in SRAM scaling for years. Since the launch of the N5 5 nm process in 2020, the size of the SRAM 6T bitcell has remained around 0.021 µm². While transistor density in logic elements has increased, memory…

SemiWiki Daniel Nenni

Accellera’s FSL 1.0 Gives Functional Safety Data a Common Language

Accellera Systems Initiative has approved Functional Safety Language Standard 1.0 for release, addressing a persistent challenge in semiconductor development: moving safety information reliably between tools, engineering teams, and companies. Announced October 21, the standard establishes a common language and data……

EE Times Pablo Valerio

Automakers Reconsider In-Cabin Sensing for Euro NCAP Ratings

Stricter European safety assessment criteria are prompting car companies to replace steering-wheel sensors with consolidated in-cabin systems. The post Automakers Reconsider In-Cabin Sensing for Euro NCAP Ratings appeared first on EE Times.

videocardz.com via r/hardware /u/HLumin

Intel Core Ultra 4000 Nova Lake-S leak: 24-core CPU beats Core Ultra 9 285K in single-thread test.

The highest result attributed to a 24-core Nova Lake-S processor reaches 5,210 points in the single-thread test, followed by another submission scoring 5,191 points. For comparison, we selected baselines from existing processors with overall CPU Mark scores close to their published PassMark Averages. The Core Ultra 9…

TechPowerUp Nomad76

(PR) DT Research Unveils LT365PA Rugged Laptop

DT Research, the leading U.S. designer and manufacturer of AI-capable, rugged computing solutions purpose-engineered for enterprise-scale customization, today announced the LT365PA Rugged Laptop, a high-performance mobile workstation that brings NVIDIA graphics, AI processing and advanced image analysis directly to…

SemiWiki Daniel Nenni

Inside the Package Powering Modern AI

TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, ……

Tom's Hardware · Semiconductors New discussion · 13h ago Newton Gitonga

Intel explores potential collaboration with AMD as Lip-Bu Tan pushes customer-focused turnaround

Intel CEO Lip-Bu Tan has reportedly discussed potential areas of cooperation with AMD chief Lisa Su as Intel works to rebuild its CPU business and expand its foundry operations. The companies have already collaborated on x86 standards and CPU software, including AMD’s integration of its ZenDNN optimizations into…

Electronics Weekly David Manners

The Elusive AI Killer App

A note from a partner in Apollo Global Management who is also the company’s Chief Economist, Torsten Slok (pictured) reinforces the flaw in the AI proposition: Where’s the killer app? […] The post The Elusive AI Killer App appeared first on Electronics Weekly.

SemiWiki Lauro Rizzatti

SEMICON West 2026: After the Toast, the Hard Questions

Champagne is an unusual opening act for a semiconductor conference. At SEMICON West 2026, October 13 to 15, at the Moscone Center in San Francisco, it served a purpose. The toast marked an industry that has already crossed $1 trillion in annual revenue, almost four years ahead of earlier projections. WSTS (World…

EE Times Aaron Fellis, corporate vice president and general manager, Wet Equipment Technology Systems, Lam Research

The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum

As AI pushes chip packages beyond traditional wafer limits, panel-level processing is emerging as a critical path to scale advanced packaging. The post The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum appeared first on EE Times.

EE Times Vasanth Sista, Field Application Engineer, TE Connectivity

Framing the Shift to 48V

From lighter wiring to automated assembly, 48V architectures are reshaping vehicle connectivity and laying the groundwork for next generation mobility. The post Framing the Shift to 48V appeared first on EE Times.

Electronics Weekly Alun Williams

KOA Speer heat shock resistors feature metal glaze resistance film

A new family of heat shock resistors from KOA Speer Electronics feature a metal glaze resistance film to provide improved high heat and weather resistance. The RK73B-AT resistors also feature […] The post KOA Speer heat shock resistors feature metal glaze resistance film appeared first on Electronics Weekly.

Older posts →