Silicon Feeds
Getting the most power from an urban-sited panel requires deep understanding of its surroundings. The post Using a Single Image to Optimize Urban Solar-Panel Orientation appeared first on EE Times.
Stricter European safety assessment criteria are prompting car companies to replace steering-wheel sensors with consolidated in-cabin systems. The post Automakers Reconsider In-Cabin Sensing for Euro NCAP Ratings appeared first on EE Times.
As AI pushes chip packages beyond traditional wafer limits, panel-level processing is emerging as a critical path to scale advanced packaging. The post The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum appeared first on EE Times.
From lighter wiring to automated assembly, 48V architectures are reshaping vehicle connectivity and laying the groundwork for next generation mobility. The post Framing the Shift to 48V appeared first on EE Times.
Google’s Project Suncatcher is testing AI hardware in space, where radiation, cooling, power, and hardware lifetime determine the economics of computing. The post In Orbit, Useful Life Becomes a Performance Metric appeared first on EE Times.
Arm's Ami Badani cites the $2 nominal damages award as validation, while chip design experts point to open architectures such as RISC-V as the long-term alternative for AI workload flexibility. The post Arm Comments on Jury Decision in Qualcomm Trial appeared first on EE Times.
The $2 damages award grabbed headlines, but the Arm-Qualcomm verdict’s bigger implication concerns who controls the compliance tests that custom chips must pass before shipping. The post Two Dollars and a Test Suite appeared first on EE Times.
See how BIWIN’s SSD, embedded storage, and memory portfolio supports faster, efficient AI from cloud data centers to edge wearables. The post From Cloud AI to Edge AI: How BIWIN Enables the Next Generation of Storage and Memory Solutions appeared first on EE Times.
Deepx is combining low-power AI accelerators and portable software with industry partnerships to bring physical AI into production. The post Deepx Building Open Software Ecosystem to Scale Physical AI Beyond the Data Center appeared first on EE Times.
Explore Goodram’s European approach to DRAM and SSD testing, from burn-in to platform validation, for reliable industrial and embedded systems. The post How Goodram Validates DRAM and SSD Reliability in Europe appeared first on EE Times.
In an exclusive interview, Everspin CEO Sanjeev Aggarwal discusses MRAM opportunities amid NOR flash supply constraints. The post Everspin Expands MRAM Push into AI Servers, Data Centers, Satellite Systems appeared first on EE Times.
GPS jamming is rising. Learn how 4G, 5G, and NTN positioning give mission-critical devices a trusted fallback when GNSS fails. The post When GPS Isn’t Enough: Building a Second Layer of Positioning appeared first on EE Times.
NI said Kaynes Semicon has selected its semiconductor test systems, while other Indian OSATs continue to evaluate equipment as manufacturers prepare for production. The post India’s OSAT Buildout Puts Semiconductor Testing in Focus appeared first on EE Times.
Demand for custom silicon is rising as physical AI, data centers, automotive systems, and edge devices require architectures optimized for specific workloads, memory bandwidth, latency, and energy efficiency. Delivering these designs requires teams to coordinate heterogeneous compute blocks, complex interconnects, and…
A new MCU combines AI-native acceleration with integrated high-bandwidth DRAM scalable to hundreds of megabytes. The post Edge AI MCU Features Multimodal Compute, Tiered Memory appeared first on EE Times.