Silicon Feeds
TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, ……
Intel CEO Lip-Bu Tan has reportedly discussed potential areas of cooperation with AMD chief Lisa Su as Intel works to rebuild its CPU business and expand its foundry operations. The companies have already collaborated on x86 standards and CPU software, including AMD’s integration of its ZenDNN optimizations into…
As AI pushes chip packages beyond traditional wafer limits, panel-level processing is emerging as a critical path to scale advanced packaging. The post The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum appeared first on EE Times.
The slab pull request was just merged for Linux 7.4. For end users nothing too incredibly exciting but there is one change that does yield a 24% throughput improvement in a benchmark exercising the kernel's memory management subsystem...
Company says foreign-made robotic vehicles are crucial to US chip production.
SK hynix abandons IPO plans for Solidigm, confirms plans to build a Solidigm 3D NAND fab in the U.S.
China has stretched older DUV lithography far further than expected, using multiple patterning to approach 5nm-class without EUV. But experts say the trade-offs in cost, yield, and die size mean further advancements are unlikely to be economically viable.
CHIPS Act $389M to power chips, vertical GaN, materials; Micron's memory roadmap; Nvidia expands supply chain capacity; Tenstorrent raises $1.5B; China NAND fabs; 800V power for AI data centers; Intel advances Arizona fab; China orders +$35B in Nvidia GPUs. The post Chip Industry Week In Review appeared first on…
The continued growth of orbital debris threatens the safety and sustainability of near-Earth space, making Active Debris Removal (ADR) an important mitigation strategy. Selecting $k$ targets from $N$ candidates yields a combinatorial search space of size $\binom{N}{k}$, making joint target selection and mission…
Intel makes progress on its manufacturing expansion in Arizona and Ohio as it continues to expand advanced semiconductor manufacturing capacity in the U.S.
Intel Ohio One is making progress with truss installation as part of its construction and future wafer capacity The post Intel Moves Forward at Ohio One With First Major Structural Truss Installation Arizona Fab 62 Tooling appeared first on ServeTheHome.
Four contract workers died after a fall at TSMC’s Fab 22 construction site in Kaohsiung, Taiwan.
Wiring and bandwidth bottlenecks between a quantum processor and room-temperature electronics can be reduced by placing digital control at the cryogenic stage, but commercial foundry standard-cell libraries are not specified for operation at 4 K. A cryogenic recharacterization flow is therefore developed for a…
SK hynix reportedly conditions building new Solidigm 3D NAND fab in the U.S. to equipment exports to the Solidigm fab in Dalian, China.
TSMC's management confirms that the company is looking forward to expand U.S. capacity beyond Arizona and Texas is one of its options. However, to become a part of the Terafab project, it insists on running the whole fab.
AMD is pursuing a 'broader partnership' with Samsung as memory company wants to tie advanced memory supply to its orders at its foundry unit.
The U.S. Department of Commerce has finalized a CHIPS and Science Act R&D award of up to $1 billion for Anderon, a quantum foundry IBM established earlier this year. The 16 September announcement backs a manufacturing service for IBM and other quantum-hardware developers. IBM is matching the award with US $1 billion…
We're at the final day of the AI Infrastructure Summit, and the booths come down around me as I walk. You get Dnotita's vector database ASIC back from the fab, SK Hynix mocking up high bandwidth flash, Marvell showing photonics, and a 30 watt box running 120 billion parameters for 2,100 dollars. Ruby Goodall, who runs…
China's DRAM champion CXMT is reportedly planning to enter 3D NAND production as it plots 3D NAND research programs and pilot line at its future fab near Beijing.
As many semiconductor fabs and facilities go online in the 2030s and beyond, a global consulting firm said that these sites will need thousands of engineers and technicians that the U.S. will be hard-pressed to fill.
Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.
TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MOU was announced during the AI Summit, held at The Midway in San Francisco.…
Large Language Models (LLMs) demand immense amounts of memory, and the more people use them, the more memory is required. Memory makers responded by accelerating plans to build new memory fabs, with a focus on High Bandwidth Memory (HBM) and DRAM, the first of which is scheduled to start production in 2027. But the…
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company. By…
Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s Device Solutions America headquarters in San Jose, California. Under the theme…
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This initiative is built on years of partnership with millions of devices shipped with…
Samsung Electronics, a world leader in advanced semiconductor technology, today hosted Samsung Foundry Forum (SFF) 2023 Europe and unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer process to the 8-inch legacy process. Alongside its customers and Samsung Advanced…