More Details on Broadcom's Beast XPU
Broadcom's Beast XPU is coming in 2028 with 16 HBM stacks and 8 compute dies on a single package, but how do you actually build something that big? At OCP Taiwan, Broadcom's VP of ASIC products gave a talk on 3.5D heterogeneous "scale-in" packaging, covering face-to-face bonding, 8x higher thermal density, chiplet…