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More Details on Broadcom's Beast XPU

Broadcom's Beast XPU is coming in 2028 with 16 HBM stacks and 8 compute dies on a single package, but how do you actually build something that big? At OCP Taiwan, Broadcom's VP of ASIC products gave a talk on 3.5D heterogeneous "scale-in" packaging, covering face-to-face bonding, 8x higher thermal density, chiplet…

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Using Your Older DDR4 // The Silicon Notebook E2

Day two of the AI Infrastructure Summit, where the running theme is everyone building their own silicon. I take you from Qualcomm's AlphaWave custom silicon and Broadcom's 17,000 pin Tomahawk 6 packages to a six slot rack you carry through airport security. Alan from Giga.io explains who buys compute with no data…

Samsung · Semiconductors Samsung Newsroom

Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies

Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MOU was announced during the AI Summit, held at The Midway in San Francisco.…